Cooling Paste 4 Grams Silver

14,40

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In stock

SKU: COOLP400SI Category: Tags: , ,
Description

This Nedis® cooling paste is very heat conductive. It fills in all those microscopic imperfections on the heatsink and CPU/GPU that can trap air in them and cause a loss in the heatsink’s performance. The cooling paste ensures an outstanding heat conduction and dissipation. This allows you to run heavy programs without the motherboard getting overheated.

– Colour: Silver
– Type: Paste
– Moment Beared Temperature: -50 ~ 300 °C
– Thermal Conductivity: ≥4.63W/m-k
– Specific Gravity: ≥3.15
– Thermal Impedance: ≤0.0087 °C-in²/W
– Thixotropic Index: 280 ± 10
– Viscosity: 12500
– Contents: 4 g
– Operating temperature: -30 – 280 °C
– Content: 4 g

Specifications

This Nedis® cooling paste is very heat conductive. It fills in all those microscopic imperfections on the heatsink and CPU/GPU that can trap air in them and cause a loss in the heatsink’s performance. The cooling paste ensures an outstanding heat conduction and dissipation. This allows you to run heavy programs without the motherboard getting overheated.

- Colour: Silver
- Type: Paste
- Moment Beared Temperature: -50 ~ 300 °C
- Thermal Conductivity: ≥4.63W/m-k
- Specific Gravity: ≥3.15
- Thermal Impedance: ≤0.0087 °C-in²/W
- Thixotropic Index: 280 ± 10
- Viscosity: 12500
- Contents: 4 g
- Operating temperature: -30 - 280 °C
- Content: 4 g

Packaging
Length: 0 mm
Width: 0 mm
Height: 0 mm
Weight: 0 kg