AGT-044-FLUX ROSIN BASED-NO CLEAN 0.05L
€6,00
In stock
Discover the new standard in soldering with Flux TK83 – your key to precise and reliable assembly of SMD and BGA components. Designed to meet the demands of electronics professionals, Flux TK83 is not just an ordinary soldering aid it’s a product that will transform your devices, ensuring longevity and reliability.
High-Quality Flux: Flux TK83 is a moderately active, liquid flux composed of an alcoholic solution of rosin with added organic activators. Its excellent formula ensures unparalleled solderability even in the most demanding applications. With a density of 0.86 g/cm³ at 20°C, this flux is exceptionally efficient and easy to use.
Versatile Applications: Ideal for assembling SMD and BGA components and manual tinning to restore solderability. It also excels in machine soldering, tinning wire ends, mixed assembly, and soldering passivated surfaces.
High Standards: Adhering to quality standards in electronics manufacturing is crucial. Therefore, Flux TK83 meets ISO 9454 type 1134 and J-STD-004 ROL0 standards, ensuring top quality and reliability.
“No Clean” Formula: One of the most important features of Flux TK83 is its “No Clean” property. This means there’s no need to wash off residues after soldering, significantly simplifying and speeding up the production process. The flux residues are non-corrosive, keeping your devices safe and reliable.
High Soldering Temperature: The product ensures high soldering efficiency at temperatures up to 280°C, making it suitable for a wide range of applications.
Discover the new standard in soldering with Flux TK83 – your key to precise and reliable assembly of SMD and BGA components. Designed to meet the demands of electronics professionals, Flux TK83 is not just an ordinary soldering aid it’s a product that will transform your devices, ensuring longevity and reliability.
High-Quality Flux: Flux TK83 is a moderately active, liquid flux composed of an alcoholic solution of rosin with added organic activators. Its excellent formula ensures unparalleled solderability even in the most demanding applications. With a density of 0.86 g/cm³ at 20°C, this flux is exceptionally efficient and easy to use.
Versatile Applications: Ideal for assembling SMD and BGA components and manual tinning to restore solderability. It also excels in machine soldering, tinning wire ends, mixed assembly, and soldering passivated surfaces.
High Standards: Adhering to quality standards in electronics manufacturing is crucial. Therefore, Flux TK83 meets ISO 9454 type 1134 and J-STD-004 ROL0 standards, ensuring top quality and reliability.
“No Clean” Formula: One of the most important features of Flux TK83 is its “No Clean” property. This means there’s no need to wash off residues after soldering, significantly simplifying and speeding up the production process. The flux residues are non-corrosive, keeping your devices safe and reliable.
High Soldering Temperature: The product ensures high soldering efficiency at temperatures up to 280°C, making it suitable for a wide range of applications.
