Heat Sink Paste 1.0 g Injection
€1,30
http://pictures.content4us.com/140px/HSPA01I_P30.JPG
| Weight | 23 g |
|---|---|
| Dimensions | 100 × 70 × 15 cm |
In stock
Product Description
Color:Whitebr /Thermal Conductivity :3.2Watt/m-kbr /Thermal Impedance:0.06 degree C-in2/Wattbr /Operation Temperture:-50~180 C
Description
Heat sink compound suitable for PCBs in transistors, for diodes, CPUs etc.
Use it between -50 °C and 180 °C
1 g compound injection type
Specifications
Heat sink compound suitable for PCBs in transistors, for diodes, CPUs etc.
Use it between -50 °C and 180 °C
1 g compound injection type
Packaging
Length: 100 mm
Width: 70 mm
Height: 15 mm
Weight: 23 kg
